Rehan Khalid
Education
- Ph.D. in Mechanical Engineering (Thermal Sciences), Villanova University, USA (2022)
- M.S. in Mechanical Engineering, Georgia Institute of Technology, USA (2016) — Fulbright Scholar
- B.S. in Mechanical Engineering, GIK Institute of Engineering and Technology, Pakistan (2012)
Research Interests
- Data center thermal management; rack- and server-level thermal design; single- and two-phase liquid cooling technologies; waste heat recovery and energy efficiency; thermal modeling of heat exchangers and turbomachinery.
Biography
Dr. Rehan Khalid is a thermal engineering specialist with extensive experience in data center cooling, thermal management of electronic systems, and energy-efficient cooling technologies, combining strong academic training with industry-focused research. He has over eight years of combined industrial and graduate research experience, including engineering roles at Google and Lenovo, where he contributed to the design and validation of next-generation server- and chip-level cooling solutions.
He earned his Ph.D. in Mechanical Engineering (Thermal Sciences) at Villanova University (2016–2022) as a Graduate Research Assistant in the Multiscale Systems Analysis Lab, following a Fulbright-funded M.S. at Georgia Tech (2016). Most recently he was a Mechanical Systems Engineer at Google (2024–2025) and, before that, a Thermal Engineer at Lenovo (2022–2024) and a Thermal Analytics Intern at Schneider Electric (2021).
Dr. Khalid actively serves as a reviewer for journals including Applied Energy, Building and Environment, and the Journal of Thermal Science and Engineering Applications, and was a Session Co-Chair at the IEEE ITherm Conference in 2025.
Selected Publications
- Khalid, R., Schon, S. G., Amalfi, L., Ortega, A., and Wemhoff, A. P. “Characterization of a Rack-Level Cooling System for Data Center Applications.” ASME Journal of Electronic Packaging, 2024.
- Khalid, R., Schon, S. G., Amalfi, L., Ortega, A., and Wemhoff, A. P. “Validation and Analysis of a Finned Tube Heat Exchanger Model.” ASME Journal of Electronic Packaging, 2024.
- Khalid, R., and Wemhoff, A. P. “Thermal Control Strategies for Reliable and Energy Efficient Data Centers.” ASME Journal of Electronic Packaging, 2019.
- Khalid, R., Wemhoff, A. P., and Joshi, Y. “Energy and Exergy Analysis of Modular Data Centers.” IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017.
Honors and Awards
- Fulbright Scholarship (2014–2016)
- Outstanding Paper Award, InterPACK (2021)
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